BUI, TINH QUOC, Department of Mechanical and Environmental Informatics, Tokyo Institute of Technology, 2-12-1-W8-22, Ookayama, Meguro-ku, Tokyo, 152-8552, Japan, Japan

• The 5th International Conference on Computational Methods (ICCM2014) - MS-7: Modeling and simulation of functional materials and structures
  Transient dynamic crack analysis in multifield coupled smart functional materials by XFEM
  Abstract  PDF