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Author Details
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BUI, TINH QUOC, Department of Mechanical and Environmental Informatics, Tokyo Institute of Technology, 2-12-1-W8-22, Ookayama, Meguro-ku, Tokyo, 152-8552, Japan, Japan
The 5th International Conference on Computational Methods (ICCM2014)
- MS-7: Modeling and simulation of functional materials and structures
Transient dynamic crack analysis in multifield coupled smart functional materials by XFEM
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