ICCM Conferences, THE 11TH INTERNATIONAL CONFERENCE ON COMPUTATIONAL METHODS (ICCM2020)

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Debonding analysis of adhesively bonded pipe joints subjected to combined thermal and mechanical loadings
Jun Han, Huanliang Zhang, Lan Zeng, Hong Yuan

Last modified: 2020-06-21

Abstract


In this paper, an analytical solution for the full-range behavior of pipe joints under combined thermal and mechanical loadings is presented. The solution is based on a rigid-softening bond-slip model and compared with finite element results. Through the nonlinear fracture mechanics, the analytical expressions of the interfacial shear stress and the load-displacement relationship could be obtained. The stress transfer mechanism, the interface crack propagation and the ductility behavior of the joints could be explained.

Keywords


debonding, temperature, pipe joints, interface

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